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封裝工藝高級工程師
面議 武漢江夏區(qū) 應(yīng)屆畢業(yè)生 本科
武漢奧新科技有限公司 2024-12-06 13:53:42
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封裝工藝高級工程師
面議 武漢江夏區(qū) 應(yīng)屆畢業(yè)生 本科
武漢奧新科技有限公司 2024-12-06 13:53:42
人關(guān)注
職位描述
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1.Project leader for engineering role with great leadership and resilience for varieties of challenges, automotive experience is preferred.

2. Great ownership for process and can provide technical skills and expertise in all aspects of PCBA processes, including soldering, assembly, inspection.

3. Strong problem-solving skills and ability to analyze complex technical issues.

4. Excellent communication and interpersonal skills, with the ability to collaborate effectively across functions, levels of the organization and customers.

5. Master Automotive Quality Tool (APQP, PPAP FMEA, MSA, SPC)

6. Participate in design for manufacturability (DFM) reviews to provide input on PCBA process feasibility, efficiency, and cost-effectiveness.

7. Excellent Logic Report capability. (eg, CAPA,8D,QCAP etc.)

8. Drive continuous improvement initiatives to enhance productivity, efficiency, and yield in PCBA operations.

9. Collaborate with cross-functional teams to develop and optimize PCBA manufacturing processes to meet quality, cost, and delivery targets.

10. Process concept and RFQ capability for PCBA NPI.

11. Develop and deliver training programs for PCBA technicians and operators to ensure adherence to standard operating procedures and quality standards.

12. Collaborate with suppliers and vendors to evaluate new materials, components, and equipment for PCBA processes, and make recommendations for procurement as needed.

13. Knowledge of advanced PCBA technologies, such as microelectronics assembly, flip-
chip bonding, wire bonding, and chip-on-board (COB) assembly. This is Plus if excellent capability on COB management

14. Above 8 years of experience required in PCBA manufacturing and EMS industry.
聯(lián)系方式
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工作地點
地址:武漢江夏區(qū)東湖新技術(shù)開發(fā)區(qū)民族大道長城創(chuàng)新科技園
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